CD74HC132E vs HD74HC132RPEL feature comparison

CD74HC132E Intersil Corporation

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HD74HC132RPEL Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP RENESAS ELECTRONICS CORP
Package Description DIP-14 SOP, SOP14,.25
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 215.8
CO2e (mg) 20219.441 2675.92
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 38 ns 25 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 6 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 125 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 3.95 mm

Compare CD74HC132E with alternatives

Compare HD74HC132RPEL with alternatives