CD74HC132E
vs
MC74HCT00ADR2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
DIP-14
|
SOP, SOP14,.25
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP14,.3
|
SOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Prop. Delay@Nom-Sup |
31 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
YES
|
NO
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
6
|
3
|
JESD-609 Code |
|
e0
|
Packing Method |
|
TAPE AND REEL
|
Power Supplies |
|
5 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|