CD74HC132E
vs
MM54HC132J
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
GENERAL ELECTRIC SOLID STATE
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP-14
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
31 ns
37 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
6
3
Family
HC/UH
JESD-609 Code
e0
Length
19.43 mm
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
37 ns
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Width
7.62 mm
Compare CD74HC132E with alternatives
Compare MM54HC132J with alternatives