CD74HC132EX vs 74HC132PW feature comparison

CD74HC132EX Intersil Corporation

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74HC132PW NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 SOT-402-1, TSSOP-14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 62.85
CO2e (mg) 20219.441 779.34
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 38 ns 31 ns
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code TSSOP
Pin Count 14
Family HC/UH
Length 5 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

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