CD74HC132EX vs 74HCT132N,652 feature comparison

CD74HC132EX Harris Semiconductor

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74HCT132N,652 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 38 ns 41 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code DIP
Pin Count 14
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
Length 19.025 mm
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 50 ns
Seated Height-Max 4.2 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

Compare CD74HC132EX with alternatives

Compare 74HCT132N,652 with alternatives