CD74HC132EX vs MC74HC00ADR2 feature comparison

CD74HC132EX Intersil Corporation

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MC74HC00ADR2 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 SOIC-14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 5
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 110 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm

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