CD74HC132EX vs MC74HC132ADR2G feature comparison

CD74HC132EX Harris Semiconductor

Buy Now Datasheet

MC74HC132ADR2G onsemi

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ONSEMI
Package Description DIP, DIP14,.3 SOIC-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 38 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC-14 NB
Pin Count 14
Manufacturer Package Code 751A-03
ECCN Code EAR99
Factory Lead Time 53 Weeks, 5 Days
Samacsys Manufacturer onsemi
Length 8.65 mm
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 75 mA
Propagation Delay (tpd) 190 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare CD74HC132EX with alternatives

Compare MC74HC132ADR2G with alternatives