CD74HC132EX vs MM74HC132MTC feature comparison

CD74HC132EX Intersil Corporation

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MM74HC132MTC Texas Instruments

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Source Content uid CD74HC132EX MM74HC132MTC
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Package Description DIP, DIP14,.3 TSSOP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 3
Part Package Code TSSOP
Pin Count 14
Family HC/UH
Length 5 mm
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 32 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 4.4 mm

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