CD74HC132M vs 74HCT132N,652 feature comparison

CD74HC132M Intersil Corporation

Buy Now Datasheet

74HCT132N,652 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 151.15 1630.6
CO2e (mg) 1874.26 20219.441
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Prop. Delay@Nom-Sup 38 ns 41 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 6 1
Part Package Code DIP
Package Description DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
Family HCT
Length 19.025 mm
Number of Functions 4
Number of Inputs 2
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 50 ns
Seated Height-Max 4.2 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

Compare CD74HC132M with alternatives

Compare 74HCT132N,652 with alternatives