CD74HC157M
vs
74HC157D
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Base Number Matches |
7
|
4
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
3.90 MM, PLASTIC, MS-012, SOT109-1, SO-16
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| Family |
|
HC/UH
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e4
|
| Length |
|
9.9 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
MULTIPLEXER
|
| Max I(ol) |
|
0.004 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Outputs |
|
1
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
31 ns
|
| Propagation Delay (tpd) |
|
38 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
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