CD74HC244M96 vs TC74HC244AFW-TP2ELP feature comparison

CD74HC244M96 Harris Semiconductor

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TC74HC244AFW-TP2ELP Toshiba America Electronic Components

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 33 ns
Propagation Delay (tpd) 165 ns 23 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Part Package Code SOIC
Package Description SOP,
Pin Count 20
Length 12.8 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.7 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

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