CD74HC4050E vs TC74HC4050AP feature comparison

CD74HC4050E General Electric Solid State

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TC74HC4050AP Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 7 1
Rohs Code Yes
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Family HC
JESD-30 Code R-PDIP-T16
Length 19.25 mm
Load Capacitance (CL) 150 pF
Logic IC Type BUFFER
Max I(ol) 0.0078 A
Number of Functions 6
Number of Inputs 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 75 mA
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 145 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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