CD74HC688M vs 74HC688N feature comparison

CD74HC688M Texas Instruments

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74HC688N NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description GREEN, PLASTIC, SOIC-20 PLASTIC, DIP-20
Pin Count 20 20
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments NXP
Additional Feature CASCADABLE CASCADABLE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDIP-T20
JESD-609 Code e4 e4
Length 12.8 mm 26.73 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MAGNITUDE COMPARATOR IDENTITY COMPARATOR
Max I(ol) 0.0052 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP20,.4 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 36 ns
Propagation Delay (tpd) 255 ns 51 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 7.62 mm
Base Number Matches 6 3

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