CD74HC75EX vs TC74HC259P feature comparison

CD74HC75EX Harris Semiconductor

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TC74HC259P Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Logic IC Type D LATCH D LATCH
Number of Bits 2 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL LOW LEVEL
Base Number Matches 3 1
Rohs Code No
Part Package Code DIP
Pin Count 16
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
JESD-609 Code e0
Length 19.43 mm
Propagation Delay (tpd) 205 ns
Seated Height-Max 5 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

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