Findchips: Compare CD74HCT00E vs 74HC00D,652

CD74HCT00E vs 74HC00D,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	THOMSON CONSUMER ELECTRONICS	NXP SEMICONDUCTORS
Package Description	DIP-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Equivalence Code	DIP14,.3	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Prop. Delay@Nom-Sup	30 ns	27 ns
Propagation Delay (tpd)	25 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Supply Voltage-Max (Vsup)	5.5 V	6 V
Supply Voltage-Min (Vsup)	4.5 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Base Number Matches	7	2
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
ECCN Code		EAR99
Samacsys Manufacturer		NXP
Family		HC/UH
JESD-609 Code		e4
Length		8.65 mm
Moisture Sensitivity Level		1
Packing Method		TUBE
Peak Reflow Temperature (Cel)		260
Seated Height-Max		1.75 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates