CD74HCT00E vs MM74HCT00N feature comparison

CD74HCT00E General Electric Solid State

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MM74HCT00N Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE ROCHESTER ELECTRONICS INC
Package Description DIP-14 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 7 5
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Family HCT
JESD-609 Code e3
Length 19.18 mm
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 29 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm