CD74HCT00E vs TC74HC132AFN feature comparison

CD74HCT00E General Electric Solid State

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TC74HC132AFN Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE TOSHIBA CORP
Package Description DIP-14 SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 30 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 7 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH
Length 8.65 mm
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 140 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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