CD74HCT00EX
vs
74HCT132D-Q100
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
NEXPERIA
|
| Package Description |
DIP, DIP14,.3
|
,
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T14
|
|
| JESD-609 Code |
e0
|
e4
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Prop. Delay@Nom-Sup |
30 ns
|
|
| Schmitt Trigger |
NO
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
3
|
2
|
| Date Of Intro |
|
2017-02-01
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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