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CD74HCT00EX vs 74HCT132N,652 feature comparison

CD74HCT00EX Harris Semiconductor

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74HCT132N,652 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 5 V 5 V
Prop. Delay@Nom-Sup 30 ns 41 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Base Number Matches 3 1
Part Package Code DIP
Package Description SOT-27-1, DIP-14
Pin Count 14
Manufacturer Package Code SOT27-1
Length 19.025 mm
Packing Method BULK PACK
Propagation Delay (tpd) 50 ns
Seated Height-Max 4.2 mm
Width 7.62 mm

Compare CD74HCT00EX with alternatives

Compare 74HCT132N,652 with alternatives

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