CD74HCT00EX vs GD74HCT00J feature comparison

CD74HCT00EX Intersil Corporation

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GD74HCT00J Goldstar Electron Co Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP GOLDSTAR ELECTRON CO LTD
Package Description DIP, DIP14,.3 ,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 30 ns
Schmitt Trigger NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Family HCT
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 24 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

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