CD74HCT00M vs 74HC00DB,118 feature comparison

CD74HCT00M General Electric Solid State

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74HC00DB,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 30 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 7 2
Part Package Code SSOP1
Package Description SSOP-14
Pin Count 14
Manufacturer Package Code SOT337-1
Family HC/UH
JESD-609 Code e4
Length 6.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 135 ns
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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