CD74HCT132E
vs
MM74HCT00J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
GENERAL ELECTRIC SOLID STATE
NATIONAL SEMICONDUCTOR CORP
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Base Number Matches
7
2
Pbfree Code
No
Rohs Code
No
Part Package Code
DIP
Package Description
DIP, DIP14,.3
Pin Count
14
Family
HCT
JESD-30 Code
R-GDIP-T14
JESD-609 Code
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Propagation Delay (tpd)
29 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Compare CD74HCT132E with alternatives
Compare MM74HCT00J with alternatives