Findchips: Compare CD74HCT132EX vs 74HC03DB,118

CD74HCT132EX vs 74HC03DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTERSIL CORP	NXP SEMICONDUCTORS
Package Description	DIP, DIP14,.3	SOT-337-1, SSOP-14
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Equivalence Code	DIP14,.3	SSOP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup	50 ns	29 ns
Schmitt Trigger	YES	NO
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	0.65 mm
Terminal Position	DUAL	DUAL
Base Number Matches	3	2
Part Package Code		SSOP1
Pin Count		14
Manufacturer Package Code		SOT337-1
Family		HC/UH
Length		6.2 mm
Moisture Sensitivity Level		1
Number of Functions		4
Number of Inputs		2
Output Characteristics		OPEN-DRAIN
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Propagation Delay (tpd)		29 ns
Qualification Status		Not Qualified
Seated Height-Max		2 mm
Supply Voltage-Max (Vsup)		6 V
Supply Voltage-Min (Vsup)		2 V
Time@Peak Reflow Temperature-Max (s)		30
Width		5.3 mm
	Logic » Gates	Logic » Gates