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CD74HCT132EX vs MC74HC132AN feature comparison

CD74HCT132EX Harris Semiconductor

Buy Now Datasheet

MC74HC132AN Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 ,
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Prop. Delay@Nom-Sup 50 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 3 4
Pbfree Code No
Part Package Code DIP
Pin Count 14

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