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CD74HCT132M96 vs GD54HCT00J feature comparison

CD74HCT132M96 Intersil Corporation

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GD54HCT00J LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP LG SEMICON CO LTD
Package Description SOP, SOP14,.25 DIP, DIP14,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TAPE AND REEL
Power Supplies 5 V 5 V
Prop. Delay@Nom-Sup 50 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 2

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