CD74HCT132M96 vs TC74HC132AP feature comparison

CD74HCT132M96 Rochester Electronics LLC

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TC74HC132AP Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC TOSHIBA CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
kg CO2e/kg 12.4 12.4
Average Weight (mg) 151.15 1630.6
CO2e (mg) 1874.26 20219.441
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 50 ns 140 ns
Qualification Status COMMERCIAL Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 5 1
Rohs Code Yes
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
Length 19.25 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Code DIP
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns
Schmitt Trigger YES
Seated Height-Max 4.45 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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