CD74HCT157M96E4 vs MC74AC257NG feature comparison

CD74HCT157M96E4 Texas Instruments

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MC74AC257NG onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC ONSEMI
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT AC
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e3
Length 9.9 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A 0.012 A
Moisture Sensitivity Level 1
Number of Bits 2
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 12 ns 9 ns
Propagation Delay (tpd) 190 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.44 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Factory Lead Time 4 Weeks
Output Characteristics 3-STATE

Compare CD74HCT157M96E4 with alternatives

Compare MC74AC257NG with alternatives