CDC857-3DGG
vs
935262900118
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
TSSOP,
|
TSSOP,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ALSO REQUIRES 3.3V PLL VOLTAGE
|
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| JESD-609 Code |
e4
|
e0
|
| Length |
12.5 mm
|
12.5 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
48
|
48
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
6 ns
|
6 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.1 mm
|
6.1 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| fmax-Min |
|
167 MHz
|
|
|
|
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