CLC110AJP
vs
HFA1412IPZ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
PDIP, SOIC
|
| Package Description |
PLASTIC, DIP-8
|
DIP-14
|
| Pin Count |
8
|
14, 14
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
50 µA
|
|
| Bandwidth (3dB)-Nom |
90 MHz
|
210 MHz
|
| Bias Current-Max (IIB) @25C |
50 µA
|
15 µA
|
| Input Offset Voltage-Max |
8000 µV
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.817 mm
|
19.17 mm
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-5.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Min |
0.05 A
|
0.05 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.33 mm
|
| Slew Rate-Min |
500 V/us
|
650 V/us
|
| Slew Rate-Nom |
800 V/us
|
950 V/us
|
| Supply Current-Max |
20 mA
|
6.3 mA
|
| Supply Voltage Limit-Max |
7 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
3
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare CLC110AJP with alternatives
Compare HFA1412IPZ with alternatives