CLC114AJ-QML
vs
CLC111MDC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP14,.3
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Bandwidth (3dB)-Nom |
200 MHz
|
800 MHz
|
| Bias Current-Max (IIB) @25C |
5 µA
|
|
| Input Offset Voltage-Max |
8200 µV
|
9000 µV
|
| JESD-30 Code |
R-GDIP-T14
|
R-XUUC-N4
|
| JESD-609 Code |
e0
|
|
| Length |
19.43 mm
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
4
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Min |
0.025 A
|
0.05 A
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Min |
180 V/us
|
|
| Slew Rate-Nom |
450 V/us
|
3500 V/us
|
| Supply Current-Max |
17 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Average Bias Current-Max (IIB) |
|
15 µA
|
|
|
|
Compare CLC114AJ-QML with alternatives
Compare CLC111MDC with alternatives