CLC115AJP
vs
5962-9233901M2A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
QFN
|
| Package Description |
DIP, DIP14,.3
|
QCCN, LCC20,.35SQ
|
| Pin Count |
14
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
20 µA
|
5 µA
|
| Bandwidth (3dB)-Nom |
700 MHz
|
200 MHz
|
| Bias Current-Max (IIB) @25C |
20 µA
|
5 µA
|
| Input Offset Voltage-Max |
17000 µV
|
8200 µV
|
| JESD-30 Code |
R-PDIP-T14
|
S-CQCC-N20
|
| Length |
18.288 mm
|
8.89 mm
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Min |
48 A
|
0.02 A
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP14,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN LINE
|
CHIP CARRIER
|
| Slew Rate-Min |
2200 V/us
|
180 V/us
|
| Slew Rate-Nom |
2700 V/us
|
450 V/us
|
| Supply Current-Max |
61 mA
|
17 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
8.89 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
1.905 mm
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CLC115AJP with alternatives
Compare 5962-9233901M2A with alternatives