CLP30-200B1RL vs CLP30-200B1 feature comparison

CLP30-200B1RL STMicroelectronics

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CLP30-200B1 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP-8 SOP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Surface Mount YES YES
Telecom IC Type SURGE PROTECTION CIRCUIT SURGE PROTECTION CIRCUIT
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)