CLVC1G175MYZPREP
vs
SN74LVC1G175YZPR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA, BGA6,2X3,20
|
GREEN, DSBGA-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-XBGA-B6
|
R-XBGA-B6
|
| Length |
1.4 mm
|
1.4 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
150000000 Hz
|
150000000 Hz
|
| Max I(ol) |
0.024 A
|
0.032 A
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA6,2X3,20
|
BGA6,2X3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
TR
|
| Prop. Delay@Nom-Sup |
8 ns
|
5.7 ns
|
| Propagation Delay (tpd) |
16 ns
|
13.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
0.9 mm
|
0.9 mm
|
| fmax-Min |
175 MHz
|
150 MHz
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.01 mA
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CLVC1G175MYZPREP with alternatives
Compare SN74LVC1G175YZPR with alternatives