CMX813E4 vs CXA3099N feature comparison

CMX813E4 Mx Com Inc

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CXA3099N Sony Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MX COM INC SONY CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, LSSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 5 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min -40 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.45 mm
Supply Current-Max 2 mA
Supply Voltage-Nom 5 V 1.4 V
Surface Mount YES YES
Telecom IC Type PAGING DECODER PAGING RECEIVER
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Technology BIPOLAR

Compare CMX813E4 with alternatives

Compare CXA3099N with alternatives