CMX813P3 vs TA31122F(EL) feature comparison

CMX813P3 CML Microcircuits Plc

Buy Now Datasheet

TA31122F(EL) Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CML MICROCIRCUITS LTD TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.685 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 2 mA 3 mA
Supply Voltage-Nom 5 V
Surface Mount NO YES
Telecom IC Type PAGING DECODER PAGING RECEIVER
Temperature Grade INDUSTRIAL OTHER
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

Compare CMX813P3 with alternatives

Compare TA31122F(EL) with alternatives