COM20019-HD
vs
COM20019I-HD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-48
|
TQFP-48
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
ISA; RS485
|
ISA; RS485
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| Communication Protocol |
SYNC, BYTE
|
SYNC, BYTE
|
| Data Transfer Rate-Max |
0.0390625 MBps
|
0.0390625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
| Length |
7 mm
|
7 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
48
|
48
|
| On Chip Data RAM Width |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP48,.28SQ
|
QFP48,.28SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| RAM (words) |
1024
|
1024
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare COM20019-HD with alternatives
Compare COM20019I-HD with alternatives