COM20019LJP
vs
COM20019P
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
STANDARD MICROSYSTEMS CORP
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
DIP, DIP24,.6
|
| Pin Count |
28
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| Communication Protocol |
SYNC, BYTE
|
SYNC, BYTE
|
| Data Transfer Rate-Max |
0.03814697265625 MBps
|
0.03814697265625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11.5062 mm
|
31.877 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
DIP24,.6
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
3.81 mm
|
| Supply Current-Max |
50 mA
|
50 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.5062 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare COM20019LJP with alternatives
Compare COM20019P with alternatives