CPL16R8-25NC
vs
PAL22V10C-6JC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP20,.3
|
QCCJ, LDCC28,.5SQ
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
28.5 MHz
|
117 MHz
|
| JESD-30 Code |
R-PDIP-T20
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
3
|
|
| Number of Inputs |
16
|
22
|
| Number of Outputs |
8
|
10
|
| Number of Product Terms |
64
|
132
|
| Number of Terminals |
20
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Function |
REGISTERED
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP20,.3
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
3
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
| Additional Feature |
|
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
|
| Length |
|
11.5316 mm
|
| Number of Dedicated Inputs |
|
11
|
| Number of I/O Lines |
|
10
|
| Organization |
|
11 DEDICATED INPUTS, 10 I/O
|
| Programmable Logic Type |
|
OT PLD
|
| Propagation Delay |
|
6 ns
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Width |
|
11.5316 mm
|
|
|
|
Compare CPL16R8-25NC with alternatives
Compare PAL22V10C-6JC with alternatives