CR95HF-VMD5T
vs
TLE6250GV33XUMA1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
5 X 5 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-32
|
SOP,
|
| Pin Count |
32
|
8
|
| Manufacturer Package Code |
VFQFPN
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
14 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
Infineon
|
| JESD-30 Code |
S-XQCC-N32
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Current-Max |
0.0006 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
CAN TRANSCEIVER
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
5 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Technology |
|
BICMOS
|
|
|
|
Compare CR95HF-VMD5T with alternatives
Compare TLE6250GV33XUMA1 with alternatives