CT1815
vs
3D7503G-10
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
DATA DELAY DEVICES INC
|
| Package Description |
DIP, DIP34,1.2
|
SOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T34
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Neg Supply Voltage-Nom |
-5 V
|
|
| Number of Terminals |
34
|
14
|
| Operating Temperature-Max |
100 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP34,1.2
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
HYBRID
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Length |
|
19.305 mm
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
4.57 mm
|
| Telecom IC Type |
|
MANCHESTER ENCODER/DECODER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
6.35 mm
|
|
|
|
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