CT1815
vs
HD9P6409-9Z
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MARCONI CIRCUIT TECHNOLOGY INC
|
INTERSIL CORP
|
Package Description |
DIP, DIP34,1.2
|
SOP, SOP20,.4
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDIP-T34
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
e3
|
Neg Supply Voltage-Nom |
-5 V
|
|
Number of Terminals |
34
|
20
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP34,1.2
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
HYBRID
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
2
|
Part Package Code |
|
SOIC
|
Pin Count |
|
20
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
26 Weeks
|
Length |
|
12.8 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
2.65 mm
|
Telecom IC Type |
|
MANCHESTER ENCODER/DECODER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
7.5 mm
|
|
|
|
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