CY22391LFXC-XXXT
vs
CY22391LFXC-XXX
feature comparison
|
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Datasheet
|
Buy Now
Datasheet
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
HVQCCN, LCC32,.2SQ,20
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATING AT -10 TO 70 DEGCEN AMBIENT TEMP
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
-10 °C
|
| Output Clock Frequency-Max |
166 MHz
|
166 MHz
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
30 MHz
|
100 MHz
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.93 mm
|
1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Power Supplies |
|
3.3 V
|
|
|
|