CY2DP814ZXI vs SY89874AUMGTR feature comparison

CY2DP814ZXI Cypress Semiconductor

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SY89874AUMGTR Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MICROCHIP TECHNOLOGY INC
Part Package Code TSSOP QFN
Package Description 4.40 MM, LEAD FREE, MO-153, PLASTIC TSSOP-16 HVQCCN,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 2DP 89874
Input Conditioning DIFFERENTIAL DIFFERENTIAL MUX
JESD-30 Code R-PDSO-G16 S-XQCC-N16
JESD-609 Code e3 e4
Length 5 mm 3 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level 3 2
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 16 16
Number of True Outputs 4 4
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 5 ns
Propagation Delay (tpd) 5 ns 0.7 ns
Qualification Status Not Qualified
Same Edge Skew-Max (tskwd) 0.2 ns 0.015 ns
Seated Height-Max 1.1 mm 0.9 mm
Supply Voltage-Max (Vsup) 3.465 V 3.63 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 20 40
Width 4.4 mm 3 mm
Base Number Matches 2 2
ECCN Code EAR99
Packing Method TR
fmax-Min 2500 MHz

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