CY37256VP256-66BBXC vs XCR3256XL-7FT256C feature comparison

CY37256VP256-66BBXC Cypress Semiconductor

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XCR3256XL-7FT256C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 256 MACROCELLS YES
Clock Frequency-Max 50 MHz 154 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Number of Dedicated Inputs 1
Number of I/O Lines 197 164
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1 DEDICATED INPUTS, 197 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 20 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 1 2
Pbfree Code No
ECCN Code EAR99
Factory Lead Time 12 Weeks
In-System Programmable YES
JTAG BST YES
Moisture Sensitivity Level 3
Number of Macro Cells 256
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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