CY54FCT240ATDMB
vs
HD74LV245ARP
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
HITACHI LTD
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
0.300 INCH, CERDIP-20
|
SOP, SOP20,.4
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION
|
|
Control Type |
ENABLE LOW
|
COMMON CONTROL
|
Family |
FCT
|
LV/LV-A/LVX/H
|
JESD-30 Code |
R-GDIP-T20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
|
Length |
24.13 mm
|
12.8 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUS DRIVER
|
BUS TRANSCEIVER
|
Max I(ol) |
0.048 A
|
0.008 A
|
Number of Bits |
4
|
8
|
Number of Functions |
2
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP20,.3
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Prop. Delay@Nom-Sup |
5.1 ns
|
13.5 ns
|
Propagation Delay (tpd) |
5.1 ns
|
18 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
5.08 mm
|
2.65 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Count Direction |
|
BIDIRECTIONAL
|
|
|
|
Compare CY54FCT240ATDMB with alternatives
Compare HD74LV245ARP with alternatives