CY74FCT163373CPAC
vs
IDT74FCT163373CPA8
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
0.240 INCH, 0.0196 INCH PITCH, TSSOP-48
TSSOP-48
Pin Count
48
48
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
FCT
FCT
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
e0
Length
12.5 mm
12.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.024 A
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP48,.3,20
TSSOP48,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
4.1 ns
4.2 ns
Propagation Delay (tpd)
5.5 ns
5.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
6.1 mm
6.1 mm
Base Number Matches
3
1
Additional Feature
MAX O/P SKEW = 0.5NS; TYP VOLP = 0.3V
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20
Compare CY74FCT163373CPAC with alternatives
Compare IDT74FCT163373CPA8 with alternatives