CY74FCT16373ATPAC vs QS74FCT16373ATPA feature comparison

CY74FCT16373ATPAC Cypress Semiconductor

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QS74FCT16373ATPA Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP
Package Description 0.240 INCH, 0.0196 INCH PITCH, TSSOP-48
Pin Count 48
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family FCT
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e0
Length 12.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER D LATCH
Max I(ol) 0.064 A 0.064 A
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP48,.3,20 TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Prop. Delay@Nom-Sup 5.2 ns 5.2 ns
Propagation Delay (tpd) 6.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 6.1 mm
Base Number Matches 3 3

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