CY8C22113-24PXI
vs
CY8C22113-24PI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.300 INCH, PLASTIC, DIP-8
|
0.300 INCH, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
24.24 MHz
|
24.24 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| Length |
9.779 mm
|
9.779 mm
|
| Number of I/O Lines |
6
|
6
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
256
|
256
|
| Seated Height-Max |
4.572 mm
|
4.572 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Bit Size |
|
8
|
| CPU Family |
|
M8C
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP8,.3
|
| RAM (bytes) |
|
256
|
| ROM (words) |
|
2048
|
| ROM Programmability |
|
FLASH
|
| Speed |
|
24 MHz
|
| Supply Current-Max |
|
8 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CY8C22113-24PXI with alternatives
Compare CY8C22113-24PI with alternatives