CY8C5667AXI-LP040
vs
CY8C5667AXQ-LP040T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
TQFP-100
|
LFQFP,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.3
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Boundary Scan |
YES
|
YES
|
| Bus Compatibility |
I2C; USB; PS/2
|
I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
|
| Clock Frequency-Max |
33 MHz
|
33 MHz
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e3
|
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
72
|
62
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
16384
|
16384
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
| Address Bus Width |
|
|
| External Data Bus Width |
|
|
|
|
|
Compare CY8C5667AXI-LP040 with alternatives
Compare CY8C5667AXQ-LP040T with alternatives