CYP15G0101DXA-BBC
vs
CYP15G0101DXB-BBXC
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
BGA
|
|
Package Description |
BGA-100
|
BGA-100
|
Pin Count |
100
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Data Rate |
1500000 Mbps
|
1500000 Mbps
|
JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
JESD-609 Code |
e0
|
e1
|
Length |
11 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Current-Max |
0.305 mA
|
0.5 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Infineon
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare CYP15G0101DXA-BBC with alternatives
Compare CYP15G0101DXB-BBXC with alternatives